★ Strong cutting force: the surface of the particle has a large number of sharp cutting edges, and the cutting force can reach 2-4 times of the single crystal diamond powder;
★ High polishing precision: the surface of the single crystal diamond micro-powder particles is large and hard, which is easy to produce deep scratches. The surface of the polycrystalline diamond micro-powder particles has small cutting edge and low hardness, and the Ra value of the surface of the workpiece after polishing is significantly reduced.
★ Strong holding power: the surface of the particles is rough, and the bonding with the bonding agent is more firm, which can significantly improve the holding power of the abrasives in various diamond products and improve the service life.
Note: The table shows the general granularity, and other granular products can be provided according to customer requirements.
★ Precision grinding and polishing of SiC, Al2O3 and other wafers;
★ Grinding and polishing of ceramic materials;
★ Precision grinding and polishing of metal materials such as stainless steel and aluminum alloy.